Xinchun Lu

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Friction behavior of aqueous solution at macroscale is quite different from that at nanoscale. At macroscale, tribochemistry usually occurs between lubricant and friction surfaces in the running-in process due to a high contact pressure, and most such processes can lead to friction reduction. In the present work, we reported that the hydrogen ions in(More)
We propose the use of maximal frequent itemsets (MFIs) to derive association rules from tabular datasets. We first present an efficient method to derive MFIs directly from tabular data using the information from previous search, known as tail information. Then we utilize tabular format to derive MFI, which can reduce the search space and the time needed for(More)
In recent years, a variety of film thickness measurement techniques for copper chemical mechanical planarization (CMP) are subsequently proposed. In this paper, the eddy-current technique is used. In the control system of the CMP tool developed in the State Key Laboratory of Tribology, there are in situ module and off-line module for measurement subsystem.(More)
The abrasive effect of particles is one of the basic mechanical actions in chemical mechanical polishing (CMP). In this paper, numerical simulations of particle sliding trajectories are performed to examine the influence of the kinematic parameters on the polishing uniformity of typical rotary-type CMP equipment. The trajectory simulations are carried out(More)
The requirement for noncontact thickness measurement of metallic film with nanometer precision in semiconductor industry is urgent to be satisfied. Using the flat coil model, the magnetic field distributions along the axis of the sensors with close-packed and loose-packed coils were calculated and optimized. The calculation results based on the model have(More)
In this paper, the kinematic analysis and numerical calculation are used to discuss the effect of the kinematic parameters on the final polishing result of typical rotary chemical-mechanical polishing (CMP) equipment. The relative velocity distribution and the sliding distance distribution are calculated based on the kinematic analysis. Especially, the(More)
Chemical mechanical planarization (CMP) is the most widely used planarization technique in semiconductor manufacturing presently. With the aid of in situ measurement technology, CMP tools can achieve good performance and stable productivity. However, the in situ measurement has remained unexplored from a kinematic standpoint. The available related resources(More)
Saccharides have been recognized as potential bio-lubricants because of their good hydration ability. However, the interfacial structures of saccharides and their derivatives are rarely studied and the molecular details of interaction mechanisms have not been well understood. In this paper, the supramolecular assembly structures of saccharic acids(More)
  • Jialin Wen, Tianbao Ma, Weiwei Zhang, Adri C T van Duin, Xinchun Lu
  • The journal of physical chemistry. A
  • 2017
In this work, we use ReaxFF molecular dynamics simulations to investigate the interaction between water molecules and silicon surfaces with different orientations under ambient temperatures of 300 and 500 K. We studied the water adsorption and dissociation processes as well as the silicon oxidation process on the Si (100), (110), and (111) surfaces. The(More)
In the integrated circuit (IC) manufacturing, in-situ end-point detection (EPD) is an important issue in the chemical mechanical planarization (CMP) process. In the paper, we chose the motor power signal of the polishing platen as the monitoring object. We then used the moving average method, which was appropriate for in-situ calculation process and made it(More)