Xiaoyao Liang

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Design variability due to die-to-die and within-die process variations has the potential to significantly reduce the maximum operating frequency and the effective yield of high-performance microprocessors in future process technology generations. One serious manifestation of this increased variability is a reduction in the mean frequency of fabricated chips(More)
Process variations are poised to significantly degrade performance benefits sought by moving to the next nanoscale technology node. Parameter fluctuations in devices can introduce large variations in peak operation among chips, among cores on a single chip, and among microarchitectural blocks within one core. Hence, it will be difficult to only rely on(More)
Process variations will greatly impact the stability, leakage power consumption, and performance of future microprocessors. These variations are especially detrimental to 6T SRAM (6-transistor static memory) structures and will become critical with continued technology scaling. In this paper, we propose new on-chip memory architectures based on novel 3T1D(More)
Design variability due to within-die and die-to-die process variations has the potential to significantly reduce the maximum operating frequency and the effective yield of high-performance microprocessors in future process technology generations. This variability manifests itself by increasing the number and criticality of long delay paths. To quantify this(More)
The heavily-threaded data processing demands of streaming multiprocessors (SM) in a GPGPU require a large register file (RF). The fast increasing size of the RF makes the area cost and power consumption unaffordable for traditional SRAM designs in the future technologies. In this paper, we propose to use embedded-DRAM (eDRAM) as an alternative in future(More)
......Technology nanoscaling promises increasing transistor density and increasing performance in microprocessors. However, the road toward this promise is fraught with difficulties resulting from increased process variations that limit performance gains and affect the stability of key circuit blocks such as on-chip memories. Addressing these problems(More)
The need to perform power analysis in the early stages of the design process has become critical as power has become a major design constraint. Embedded and high-performance microprocessors incorporate large on-chip cache and similar SRAM-based or CAM-based structures, and these components can consume a significant fraction of the total chip power. Thus an(More)
Process variation will greatly impact the power and performance of future microprocessors. Design approaches based on multiple supply or threshold voltage assignment provide techniques to statically tune critical path delays for energy savings [1]. However, under process variation, the delay of critical paths may vary, and a large number of critical paths(More)
Recent years have seen an explosion of data volumes from a myriad of distributed sources such as ubiquitous cameras and various sensors. The challenges of analyzing these geographically dispersed datasets are increasing due to the significant data movement overhead, time-consuming data aggregation, and escalating energy needs. Rather than constantly move a(More)
Process variation poses a threat to the performance and reliability of the 6T SRAM cell. Research has turned to new memory cell designs, such as the 3T1D DRAM cell, as potential replacement designs. If designers are to consider 3T1D memory architectures, performance models are needed to better understand memory cell behavior. We propose a decoupled approach(More)