Xiangdong Qiu

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The solder joint reliability under thermomechanical fatigue is a very strong function of package size and thermal expansion mismatch for a large ceramic leadless chip carrier package (CLCC) with perimeter I/O. If these factors cannot be adjusted, the design space for successful implementation of such a package becomes drastically small. We discuss the(More)
Addition of a physiological concentration of NaCl (0.9%) to 0.05 mol/l Tris buffer (pH 7.4) reversed the enhancement of the activation of glutamic-type plasminogen (Glu-Plg) by low molecular weight urokinase by fucoidan and heparin, while addition of aminohexanoic acid (6-AH) enhanced the activation. Native fucoidan (N-2), sulfated fucoidan (S-2) and(More)
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