Wing Chiu Tam

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Traditional software-based diagnosis of failing chips typically identifies several lines where the failure is believed to reside. However, these lines can span across multiple layers and can be very long in length. This makes physical failure analysis difficult. In contrast, there are emerging diagnosis techniques that identify both the faulty lines as well(More)
Integrated circuit (IC) diagnosis typically analyzes failed chips by reasoning about their responses to test patterns to deduce what has gone wrong. Current trends use diagnosis as the first step in extracting valuable information from a large population of failing ICs that include, for example, design-feature failure rates and defect-occurrence statistics.(More)
—Design for manufacturability (DFM) is essential because of the formidable challenges encountered in nano-scale integrated circuit (IC) fabrication. Unfortunately, it is difficult for designers to understand the cost-benefit tradeoff when tuning their design through DFM to achieve better manufacturabil-ity. This paper attempts to assist the designer in(More)