William V. Jecusco

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Substrates for most of today's electronic products contain many wiring layers which are individually fabricated, mechanically registered with one another, and laminated together. Alignment tolerances of 0.05 mm to 0.1 mm are suucient to register the vertical connection pads or vias on each layer. More aggressive designs of the future will, however, require(More)
Assembly accuracies of 0.05-0.1 mm, needed for electronic product manufacture, are attainable with current automated manufacturing equipment. Aggressive electronic system designs will require manufacturing accuracies in the range of 0.005-0.01 mm. A system and strategy is described here to fabricate circuit boards requiring alignment accuracies of 7.5 pm(More)
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