Learn More
The basic unit of information in filamentary-based resistive switching memories is physically stored in a conductive filament. Therefore, the overall performance of the device is indissolubly related to the properties of such filament. In this Letter, we report for the first time on the three-dimensional (3D) observation of the shape of the conductive(More)
Atom-probe (AP) analysis of silicon based samples frequently fail due to rupture of the tip. We have investigated the stability and failure mechanisms of silicon tips when prepared for AP analysis via Focused Ion Beam (FIB) milling. We observed four mechanisms that commonly lead to failure of the tips. These mechanisms are a deformation of the tips apex due(More)
On the development of flexible electronics, a highly flexible nonvolatile memory, which is an important circuit component for the portability, is necessary. However, the flexibility of existing nonvolatile memory has been limited, e.g. the smallest radius into which can be bent has been millimeters range, due to the difficulty in maintaining memory(More)
Composition depth profiling of HfO(2) (2.5 nm)/SiON (1.6 nm)/Si(001) was performed by three diffetent analytical techniques: high-resolution Rutherford backscattering spectroscopy (HRBS), angle-resolved X-ray photoelectron spectroscopy (AR-XPS) and high-resolution elastic recoil detection (HR-ERD). By comparing these results we found the following: (1) HRBS(More)
Germanium combined with high-␬ dielectrics has recently been put forth by the semiconductor industry as potential replacement for planar silicon transistors, which are unlikely to accommodate the severe scaling requirements for sub-45-nm generations. Therefore, we have studied the atomic layer deposition ͑ALD͒ of HfO 2 high-␬ dielectric layers on HF-cleaned(More)
Filamentary-based oxide resistive memory is considered as a disruptive technology for nonvolatile data storage and reconfigurable logic. Currently accepted models explain the resistive switching in these devices through the presence/absence of a conductive filament (CF) that is described as a reversible nanosized valence-change in an oxide material. During(More)
Nowadays, technological developments towards advanced nano scale devices such as FinFETs and TFETs require a fundamental understanding of three-dimensional doping incorporation, activation and diffusion, as these details directly impact decisive parameters such as gate overlap and doping conformality and thus the device performance. Whereas novel doping(More)
We report the improved thermal stability of carbon alloyed Cu0.6Te0.4 for resistive memory applications. Copper-tellurium-based memory cells show enhanced switching behavior, but the complex sequence of phase transformations upon annealing is disadvantageous for integration in a device. We show that addition of about 40 at % carbon to the Cu-telluride layer(More)
This paper explores the evolution mechanisms of metastable phases during the nanoindentation on monocrystalline silicon. Both the molecular dynamics (MD) and the in situ scanning spreading resistance microscopy (SSRM) analyses were carried out on Si(100) orientation, and for the first time, experimental verification was achieved quantitatively at the same(More)