Wilfried Vandervorst

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On the development of flexible electronics, a highly flexible nonvolatile memory, which is an important circuit component for the portability, is necessary. However, the flexibility of existing nonvolatile memory has been limited, e.g. the smallest radius into which can be bent has been millimeters range, due to the difficulty in maintaining memory(More)
Germanium combined with high-␬ dielectrics has recently been put forth by the semiconductor industry as potential replacement for planar silicon transistors, which are unlikely to accommodate the severe scaling requirements for sub-45-nm generations. Therefore, we have studied the atomic layer deposition ͑ALD͒ of HfO 2 high-␬ dielectric layers on HF-cleaned(More)
This article deals with the developments in the measurement and identification of conformality which is a key function in conformal doping. For this purpose this paper extensively uses SSRM to characterize the vertical/lateral junction depths, concentration levels and degree of conformality. As a complement to the SSRM technique this paper developes a(More)
Accurate characterization of ultra shallow junctions (USJ) is important in order to understand the principles of junction formation and to develop the appropriate implant and annealing technologies. We investigate the capabilities of a new micro-scale Hall effect measurement method where Hall effect is measured with collinear micro four-point probes (M4PP).(More)
Since the requirements for the S/D extensions for future devices become more and more severe with respect to activation and vertical abruptness, a huge effort has been done to develop ultra-fast annealing techniques such as laser annealing. Due to the fact that only the surface layers are heated, the Si wafer serves as a heat sink. Hence, extremely fast(More)
Silicon crystallizes in the diamond-cubic phase and shows only a weak emission at 1.1 eV. Diamond-hexagonal silicon however has an indirect bandgap at 1.5 eV and has therefore potential for application in opto-electronic devices. Here we discuss a method based on advanced silicon device processing to form diamond-hexagonal silicon nano-ribbons. With an(More)
The introduction of millisecond annealing in advanced CMOS process flows turns out to generate considerable temperature variations which can enhance the device dispersion. In the present work we report on the use of inline Therma-Probe (TP) and Micro Four-Point Probe (M4PP) metrology to assess these temperature variations on shallow trench isolation (STI)(More)
Sub-melt laser annealing is a promising technique to achieve the required sheet resistance and junction depth specifications for the 32 nm technology node and beyond. In order to obtain a production worthy process with minimal sheet resistance variation at a macroscopic and microscopic level, careful process optimization is required. While macroscopic(More)