Wenguo Dong

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Nanoparticles of Cu or Cu oxide dispersed in a polyimide (PI) film were fabricated by reaction of polyamic acid with a thin Cu film during imidization. In this paper, the thermal stability of the Cu or Cu oxide nanoparticles was investigated under various atmospheres. The PI/nanoparticle composites were heat-treated at 140 degrees C and 250 degrees C in(More)
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