Wen-Yao Chang

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As continued scaling becomes increasingly difficult, 3D integration with through silicon vias (TSVs) has emerged as a viable solution to achieve higher bandwidth and power efficiency. Mechanical stress induced by thermal mismatch between TSVs and the silicon bulk arising during wafer fabrication and 3D integration, is a key constraint. In this work, we(More)
In this paper, we propose a new cache management scheme in the proxy server for location based services. The proxy server is able to cache query results of location-based services (LBS). One of the major LBS is mobile advertising. Mobile advertising is to distribute advertising messages to the target users with mobile devices. Nowadays, users are willing to(More)
Recent studies show that intersections account for around 43% of all traffic accidents and enhanced communication between traffic signals and vehicles can possibly lead to a 50% reduction in such accidents. With the advancement of dedicated short range communications (DSRC) technologies such as IEEE 1609 (Wireless Access in Vehicular Environments, WAVE), it(More)
Dynamical structural defects exist naturally in a wide variety of solids. They fluctuate temporally and hence can deteriorate the performance of many electronic devices. Thus far, the entities of these dynamic objects have been identified to be individual atoms. On the other hand, it is a long-standing question whether a nanocrystalline grain constituted of(More)
As continued scaling becomes increasingly difficult, 3D integration with through silicon vias (TSVs) has emerged as a viable solution to achieve higher bandwidth and power efficiency. Mechanical stress induced by thermal mismatch between TSVs and the silicon bulk arising during wafer fabrication and 3D integration, is a key constraint. In this work, we(More)
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