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The drop resistance and fracture behavior of Sn–37Pb, Sn–3.0Ag–0.5Cu (SAC305), Sn–1.0Ag–0.5Cu (SAC105), and Sn–8.5Zn–0.5Ag–0.01Al–0.1 Ga (SnZn-5e) solder ball joints under the board-level drop test (BLDT) and the ball impact test (BIT) were studied. The results show that the drop reliabilities in terms of the characteristic life ratio from the Weibul plot(More)
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