Wang Xiangru

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One kind of TSOP package (Device 98M16 encapsulated by mold compound 7351LS) encountered serious open failure after Data Retention 4 test (DR4, 5000 hours baking at 150 degC) and the failure rate is almost 100%. But a similar package (Device 98R16 encapsulated by mold compound G700L) is normal after test. Failure analyses were done for the two packages. The(More)
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