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  • Robert Daily, Wang Teng, Giovanni Capuz, Andy Miller
  • Materials Science
  • IEEE 63rd Electronic Components and Technology…
  • 2013 (First Publication: 1 May 2013)
  • Requirements for thermocompression bonding (TCB) successfully are dependent on the material as well as the area required to join. One of the paths for 3D integration is bonding Cu to Cu bumps orContinue Reading
  • Kenneth J. Rebibis, Giovanni Capuz, +8 authors Bart Swinnen
  • Materials Science
  • IEEE 15th Electronics Packaging Technology…
  • 2013 (First Publication: 1 December 2013)
  • The demands and challenges in pushing the limits of Moore's Law made the 3D IC stacking radiate the pressure for MPTs (materials, processes and tools) in keeping up with the technology. The 3D ICContinue Reading
  • Sheng Ji-qun, Xu Xiu-ling, +9 authors Wang Teng
  • Chemistry, Medicine
  • Journal of biochemical and molecular toxicology
  • 2004
  • Scorpion venom contains many small polypeptide toxins, which can modulate Na(+), K(+), Cl(-), and Ca(2+) ion-channel conductance in the cell membrane. A full-length cDNA sequence encoding a novelContinue Reading