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The temperature dependent mechanical properties of the metallization of electronic power devices are studied in tensile tests on micron-sized freestanding copper beams at temperatures up to 400 °C. The experiments are performed in situ in a scanning electron microscope. This allows studying the micromechanical processes during the deformation and failure of(More)
Electroplated copper films are known to change their microstructure due to the self-annealing effect. The self-annealing effect of electroplated copper films was investigated by measuring the time dependence of the film stress and sheet resistance for different layer thicknesses between 1.5 and 20 μm. While the sheet resistance was found to decrease as time(More)
The self-annealing effect of electroplated copper films was investigated by measuring the time dependence of the film stress for different film thicknesses between 1.5µm and 20µm. This recrystallization process results in significant microstructure change and a film-thickness-dependent stress evolution at room temperature. This behavior can be(More)
Electroplated Cu films are known to change their microstructure at room temperature due to the self-annealing effect. This recrystallization process results in a film-thicknessdependent stress evolution. Films with the thickness of 5μm and below decrease in stress with time, while thicker films reveal initially an increase in film stress followed by a(More)
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