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The temperature dependent mechanical properties of the metallization of electronic power devices are studied in tensile tests on micron-sized freestanding copper beams at temperatures up to 400 °C. The experiments are performed in situ in a scanning electron microscope. This allows studying the micromechanical processes during the deformation and failure of(More)
The self-annealing effect of electroplated copper films was investigated by measuring the time dependence of the film stress for different film thicknesses between 1.5µm and 20µm. This recrystallization process results in significant microstructure change and a film-thickness-dependent stress evolution at room temperature. This behavior can be(More)
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