W. P. Vellinga

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A digital image correlation (DIC) algorithm was employed to measure microscopic strain-field evolution in shear-loaded model solder interconnections made out of a number of Sn-based alloys. Four different solder alloys studied were Sn–36Pb–2Ag, Sn–3.8Ag–0.7Cu (SAC), Sn–3.3Ag–3.82Bi, and Sn–8Zn–3Bi. The measured strain fields were correlated with damage(More)
We show that variations in the relative humidity give rise to reversible macroscopic dimensional changes in nanoporous gold exposed to ambient air. The macroscopic strain is the consequence of changes in the nanoporous gold surface stress. We have measured reversible strain amplitudes up to 0.02% in response to a 15% change in relative humidity. The direct(More)
This paper investigates the adhesive interface in a polymer/metal (polyethylene terephthalate/steel) laminate that is subjected to uniaxial strain. Cross-sections perpendicular to such interfaces were created with a focused ion beam and imaged with scanning electron microscopy during straining in the electron microscope. During in situ straining, glide(More)
• A submitted manuscript is the author's version of the article upon submission and before peer-review. There can be important differences between the submitted version and the official published version of record. People interested in the research are advised to contact the author for the final version of the publication, or visit the DOI to the(More)
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