W. K. Choi

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Fan-out wafer level packaging technology becomes attractive because of its flexibility for integration of diverse devices in a small form factor. In this study, the effect of high temperature storage test on fan-out wafer level package strength was evaluated. There were three different structure fan-out wafer level packages. The high temperature storage(More)
The Fan-out Wafer Level Package (FOWLP) becomes more attractive because of its flexibility for integration of diverse devices in a very small form factor. As the FOWLP is composed of various materials, the proper structural and material designs are important to meet reliability requirements. In this study, mechanical properties of FOWLPs with different(More)
Fan-out wafer level package (FOWLP) technology becomes more attractive because of its flexibility for integration of diverse devices in a very small form factor. As FOWLP is composed of various materials, the proper structural and material selection designs are important to meet reliability requirements. In this study, thermal properties of FOWLP with(More)
Fan-out wafer level packaging technology becomes more and more popular and attractive of its flexibility for integration of diverse devices in a tiny form factor. The small and thin fan-out wafer level package has low package strength and often faces crack issues. In the previous study, the fan-out wafer level package strength increased significantly when(More)
Fan-out wafer level packaging technology becomes more attractive and popular in the semiconductor packaging industry. The fan-out wafer level package (FOWLP) has the feature of integrating various devices in a tiny form factor. Since the FOWLP size is compact and small, its package strength is critical to its reliability. In this work, the three-point(More)
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