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An emerging technology which shows promise for the fabrication of glass photonic integrated circuits (PICs), is sub-micron-scale embossing or imprinting. This approach makes use of T<inf>g</inf> (the glass transition) which gives inorganic compound glasses a key advantage over crystalline materials for fabricating photonic devices and PICs. Thus, on heating(More)
Hot embossing of novel inorganic-compound glasses is a new fabrication technology for guided wave devices and circuitry. A patterned mould is pressed into the glass above its glass transition temperature (T<sub>g</sub>) and replicated; cooling below T<sub>g</sub> freezes-in the required pattern. The state-of-the-art is reviewed. Better than 0.1 mum-scale(More)
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