Vinod Pangracious

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3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between processing cores, and an effective way to diminish this impact on communication is the 3D integration technology and the use of through-silicon vias (TSVs) for inter-layer(More)
A novel 3D Tree-based Multilevel FPGA architecture that unifies two unidirectional programmable interconnection network is presented in this paper. In a Tree based architecture, the interconnects are arranged in a multilevel network with the logic blocks placed at different Tree levels using ButterflyFat-Tree network topology. 2D physical layout development(More)
The semiconductor industry is reaching a fascinating confluence in several evolutionary trends that will likely lead to a number of revolutionary changes in the design, implementation, scaling, and the use of computer systems. However, recently Moore’s law has come to a stand-still since device scaling beyond 65 nm is not practical. 2D integration has(More)
The CMOS technology scaling has greatly improved the overall performance and density of the Mesh-based Field Programmable Gate Arrays (FPGAs), nonetheless the gap between FPGAs and ASICs in terms of logic density, speed and power consumption remains very wide mainly due the programming overhead. The logic density and area overhead is improved by using(More)
We describe a methodology to design and optimize Three-dimensional (3D) Tree-based FPGA by introducing a break-point at particular tree level interconnect to optimize the speed, area, and power consumption. The ability of the design flow to decide a horizontal or vertical network break-point based on design specifications is a defining feature of our design(More)
In this paper, we propose a 2D and 3D interconnect network based on a Mesh-of-Clusters (MoC) topology for the implementation of an efficient Field Programmable Gate Arrays (FPGA) architecture. Proposed MoC-based FPGA architecture presents a new hierarchical Switch Box (SBs) and depopulated intra-cluster interconnect based on the Butterfly-Fat-Tree (BFT)(More)
The CMOS technology scaling has greatly improved the overall performance and density of Field Programmable Gate Array (FPGA), nonetheless the performance gap between FPGA and ASIC has remain very wide mainly due the programming overhead of FPGA. Three-Dimensional (3D) integration is a promising technology to reduce wire lengths. Through Silicon Vias (TSV)(More)
In a multiprocessor system on chip (MPSoC) IC the processor is one of the highest heat dissipating devices. The temperature generated in an IC may vary with floor plan of the chip. This paper proposes an integration and thermal analysis methodology to extract the peak temperature and temperature distribution of 2-dimensional and 3-dimensional multiprocessor(More)