Viggo Tvergaard

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Two distinct mechanisms of crack initiation and advance by void growth have been identified in the literature on the mechanics of ductile fracture. One is the interaction a single void with the crack tip characterizing initiation and the subsequent void by void advance of the tip. This mechanism is represented by the early model of Rice and Johnson and the(More)
Stress dependent electrochemical dissolution is identified as one of the key mechanisms governing surface degradation in fretting and crevice corrosion of biomedical implants. The present study focuses on delineating the roles of mechanical stress and chemical conditions on the life expectancy of modular hip implants. First, material removal on a stressed(More)
Crack growth along an interface joining an elastic-plastic solid to a solid that does not yield plastically is studied numerically, accounting for mixed mode loading under conditions of small scale yielding. The fracture process is represented in terms of a cohesive zone model, for which the work of separation per unit area and the peak stress required for(More)
A preliminary theoretical study is carried out of the role of micron-scale patterning on the interface toughness of bonded Cu-to-Cu nanometer-scale films. The work is motivated by the experimental studies of [Tadepalli, R., Turner, K.T., Thompson, C.V., 2008b. Effects of patterning on the interface toughness of wafer-level Cu–Cu bonds. Acta Materialia 56,(More)