Viggo Tvergaard

John W Hutchinson7
Jes Christoffersen1
S Y H D G N H R H E1
7John W Hutchinson
1Jes Christoffersen
1S Y H D G N H R H E
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Crack propagation along one of the interfaces between a thin ductile adhesive layer and the elastic substrates it joins is considered. The layer is taken as being elastic-plastic, and the fracture process of the interface is modeled by a traction-separation law, characterized by the peak separation stress 6 and the work of separation per unit area To. Crack(More)
Two distinct mechanisms of crack initiation and advance by void growth have been identified in the literature on the mechanics of ductile fracture. One is the interaction a single void with the crack tip characterizing initiation and the subsequent void by void advance of the tip. This mechanism is represented by the early model of Rice and Johnson and the(More)
For crack growth along an interface between dissimilar materials the effect of combined modes I, II and III at the crack-tip is investigated. First, in order to highlight situations where crack growth is affected by a mode III contribution, examples of material configurations are discussed where mode III has an effect. Subsequently, the focus is on crack(More)
  • Viggo Tvergaard, John W Hutchinson, S Y E R, S Y H D G N H R H E, Y S Y H D G N R H E
  • 2014
Cropping is a cutting process whereby opposing aligned blades create a shearing failure by exerting opposing forces normal to the surfaces of a metal sheet or plate. Building on recent efforts to quantify cropping, this paper formulates a plane strain elastic-plastic model of a plate subject to shearing action by opposing rigid platens. Shear failure at the(More)
This extended comment is in response to a recent paper by Danas and Ponte Castañeda (2012) which investigates the stress– strain behavior and strain localization of porous metallic materials as a function of the Lode parameter under low triaxality stressing. The topic is of some importance owing to its relevance to recent experimental and theoretical work(More)
A preliminary theoretical study is carried out of the role of micron-scale patterning on the interface toughness of bonded Cu-to-Cu nanometer-scale films. The work is motivated by the experimental studies Mixed-mode interface toughness of wafer-level Cu–Cu bonds using asymmetric chevron test. J. Mech. Phys. Solids 56, 707–718.] wherein 400 nm Cu films were(More)
– A selection of surface crack problems is presented to provide insights into Stage I and early Stage II fatigue crack growth. Edge cracks at 45 o and 90 o to the surface are considered for cracks growing in single crystals. Both single crystal slip and conventional plasticity are employed as constitutive models. Edge cracks at 45 o to the surface are(More)
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