Vachan Kumar

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Frequency and time domain models are developed for backplane (BP), printed circuit board (PCB), and silicon interposer (SI) links using six-port transfer matrices (ABCD matrices) for bumps, vias and connectors, and coupled multiconductor transmission lines for traces. The six-port transfer matrix approach enables easy computation of the transfer function,(More)
This paper presents the major limitations to the interconnect technology scaling at future technology generations and demonstrates both evolutionary and radical potential solutions to the BEOL scaling problem. To address the local interconnect challenges, a novel hybrid Al-Cu interconnect technology is introduced. Performances of carbon-based interconnects(More)
This paper presents the first optimization methodology for silicon interposer interconnect technology. The dimensions of these fine-pitch interconnects are roughly a few microns, because of which they can neither be treated as on-chip RC interconnects, nor as conventional off-chip interconnects. 3D extraction tools can provide an accurate estimate of the(More)
In this paper we present the design and fabrication of airclad planar transmission lines and TSVs that can be used as horizontal and vertical chip-chip interconnects. Performance improvement by using heterogeneous air-clad dielectric is presented for these two types of interconnect structures that establishes the basic motivation for fabricating these(More)
Circuit-level models are developed to determine the upper bound on the performance of a 3-D IC link with through silicon vias (TSVs). It is shown that the performance of a 3-D link is limited not only by the on-chip interconnect RC, driver resistance, and TSV capacitance, but also by the current carrying capacity of the on-chip wires connecting the TSV to(More)
An overview of three-dimensional integrated circuits (3D ICs) is presented in this paper. The key potential applications of 3D ICs that have the most impact in terms of performance, power and area are highlighted, followed by a brief overview of the different technology approaches to implement 3D ICs. Further, the key challenges to 3D integration are(More)
The transformers are designed to transmit and distribute electrical power. Depending on the size of the requirement, replacement costs will be more if any fault occurs. Performing offline and invasive test also added to the replacement cost. Hence there is an increasing need to move from traditional schedule based maintenance programs to condition based(More)
The rapid development of transistor technology has resulted in higher performance and integration density. Simultaneously, the continuous increasing power has become the primary barrier against further development of VLSI (Very large scale integration) circu it design. Over the past decade, research work concerning energy efficiency of computing systems has(More)