Uichi Itoh

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This paper describes a novel Cu paste for low temperature sintering, which is necessary to fabricate electrodes on transparent conductive films in hetero-junction solar cell. To this end, glass fritless Cu alloy pastes containing a low melting point alloy were prepared. The pastes were evaluated in terms of printability, contact resistance, line resistance,(More)
In the metallization technology for power electronic device, it has been required to develop new material with low cost for operating high-temperature at 300 degree C and highly-reliable interconnection. We have developed new method to fabricate fine metal alloy particles with narrow distribution of particle size from 0.5 to 10μm. We called it as(More)
In the metallization technology for crystalline Si solar cell, it has been required to develop new material with low cost for high-temperature and highly-reliable interconnection. We have developed new method to fabricate fine metal alloy particles with narrow distribution of particle size from 0.5 to 10μm. We called it as Nanomized method. The fine(More)
We developed novel screen mask with repellent property to organic solvent containing in Ag paste to print finger electrode with high aspect ratio by single printing and to reduce bleeding caused by spreading the paste at the edge of electrode line. The average height of finger electrode is 40.6 μm and average width is 64.0 μm when using the(More)
We describe recent research activities on materials for future wavelength-multiplexed optical recording systems in Japan. Organic materials are the major objectives in this field: photochromic materials and the young field of possible photochemical hole burning materials. As for the latter, we introduce our results on organic dye molecules in polymer(More)
There are many kinds of solder joint failure modes in the crystalline Si modules which have been operated in Tsukuba, Japan for 10 years. The modules including mono crystal, multi crystal and hetero junction structure were supplied from four different companies. The samples sliced from the modules are analyzed by using optical microscope, X-ray transmission(More)
It is important to select suitable screen mask for printing fine electrode. In case of fine line printing with 50 μm width, we demonstrated that the screen mask with 39% opening is the best selection compared with 49% and 60% opening. Variation (max and min) of width and thickness of fine electrode shows lower value when using low opening rate.
In the metallization technology for power electronic device, it has been required to develop new material for operating high-temperature at 300 °C and interconnection with high bonding strength. We have developed new method to fabricate fine metal alloy particles with narrow distribution of particle size from 0.5 to 10μm. We called it as(More)
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