Tsuyoshi Horikawa

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Silicon optical interposers for inter-chip interconnects, integrated with lasers, an optical splitter, optical modulators and germanium photodetectors on a single silicon substrate were demonstrated. A 12.5-Gbps error-free data transmission and 6.6-Tbps/cm 2 transmission density were achieved.
We report on a high speed silicon-waveguide-integrated PIN Ge photodetector of 45 GHz bandwidth, and a high efficiency of 0.3 V·cm silicon optical modulator with a metal-oxide-semiconductor (MOS) junction by applying the low optical loss and high conductivity poly-silicon gate. These OE/EO devices enable low drive voltage of around 1V, which would(More)
SUMMARY One of the most serious challenges facing the exponential performance growth in the information industry is a bandwidth bottleneck in inter-chip interconnects. We therefore propose a photonics-electronics convergence system with a silicon optical interposer. We examined integration between photonics and electronics and integration between light(More)
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