Tsuyoshi Horikawa

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Silicon optical interposers for inter-chip interconnects, integrated with lasers, an optical splitter, optical modulators and germanium photodetectors on a single silicon substrate were demonstrated. A 12.5-Gbps error-free data transmission and 6.6-Tbps/cm 2 transmission density were achieved.
SUMMARY One of the most serious challenges facing the exponential performance growth in the information industry is a bandwidth bottleneck in inter-chip interconnects. We therefore propose a photonics-electronics convergence system with a silicon optical interposer. We examined integration between photonics and electronics and integration between light(More)
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