Tsung-Hsiang Lin

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3D ICs based on Through-Silicon-Vias (TSVs) enable the stacking of logic and memory dies to manufacture chips with higher performance, lower power, and smaller form factor. To improve the yield of the memory dies in 3D ICs, this paper proposes a Built-In Self-Repair (BISR) architecture which allows the sharing of spares between different layers of dies. The(More)
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