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IC bond pad structures having Al metallization and SiO2 dielectric have been traditionally designed with full plates in underlying metallization layers, connected by vias. In addition, pads having bond over active circuitry (BOAC) which are much more sensitive to pad cracks, are likely present in the same IC. Cracks in the pad dielectric weaken the bond(More)
(This is part 2, continued from “Use of harsh Wafer Probing to Evaluate Traditional Bond Pad Structures”). Goals for circuit under pad (CUP) in aluminum – silicon dioxide (Al – SiO2) based IC pad structures include the design of metal interconnects in all layers beneath the pad Al, and the ability to withstand harsh probing and wirebonding stress without(More)
We present polarization measurements of extragalactic radio sources observed during the cosmic microwave background polarization survey of the Q/U Imaging Experiment (QUIET), operating at 43GHz (Q-band) and 95GHz (W-band). We examine sources selected at 20GHz from the public, >40mJy catalog of the Australia Telescope (AT20G) survey. There are ∼480 such(More)
XPressArray-II (XPA-II) is targeted for translation of FPGA prototypes to AMIS structured digital ASICs. In particular, XPA-II I/O design simplifies the translation task by supporting several key requirements. The increasing complexity, functionality, and higher performance of today's FPGAs presents a difficult design challenge for the next generation I/O(More)
We present polarization observations of two Galactic plane fields centered on Galactic coordinates (l, b) = (0◦, 0◦) and (329◦, 0◦) at Q(43 GHz) and W-band (95 GHz), covering between 301 and 539 square degrees depending on frequency and field. These measurements were made with the QUIET instrument between 2008 October and 2010 December, and include a total(More)
An Nepi pocket isolation weakness was identified during ESD qualification of a multi-well CMOS process. Post stress Iddq leakage on an unstressed domain was discovered following supply domain matrix testing. A parasitic NPN was instrumental in creating this unusual failure signature. ESD protection network modifications alleviated the process limitations.
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