Tony F. Wu

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Next-generation information technologies will process unprecedented amounts of loosely structured data that overwhelm existing computing systems. N3XT improves the energy efficiency of abundant-data applications 1,000-fold by using new logic and memory technologies, 3D integration with fine-grained connectivity, and new architectures for computation(More)
Carbon nanotube (CNT) field-effect transistors (CNFETs) are a promising emerging technology projected to achieve over an order of magnitude improvement in energy-delay product, a metric of performance and energy efficiency, compared to silicon-based circuits. However, due to substantial imperfections inherent with CNTs, the promise of CNFETs has yet to be(More)
Introduction All technology options for three-dimensional integrated circuits (3D ICs) [Batude 11, Naito 10, Topol 05, Van Olmen 08, Wei 09, Wong 07] face the challenge of how to remove the heat dissipated on the upper layers (Fig. 1) [Kleiner 95]. Most existing techniques rely on an array of Through-Silicon Vias (TSVs) for this purpose. Here we report how(More)
Wireless body sensor nodes (WBSNs) are miniaturized devices that are able to acquire, process and transmit bio-signals (such as electrocardiograms, respiration or human-body kinetics). WBSNs face major design challenges due to extremely limited power budgets and very small form factors. We demonstrate, for the first time in the literature, the use of(More)
There are increasing concerns about possible malicious modifications of integrated circuits (ICs) used in critical applications. Such attacks are often referred to as hardware Trojans. While many techniques focus on hardware Trojan detection during IC testing, it is still possible for attacks to go undetected. Using a combination of new design techniques(More)
Monolithic three-dimensional (3D) integration enables revolutionary digital system architectures of computation immersed in memory. Vertically-stacked layers of logic circuits and memories, with nano-scale inter-layer vias (with the same pitch and dimensions as tight-pitched metal layer vias), provide massive connectivity between the layers. The nano-scale(More)
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