Tommi Sullivan

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Two key C4 reliability concerns for the current and next generation integrated circuits are electromigration (EM) and “white C4” bumps caused by the stresses induced by die-package interactions. This paper discusses novel design and integration changes in the final polymeric passivation via (FV) in order to mitigate white bump and chip-package(More)
Electroencephalography makes use of sensors to capture time varying magnitude of electric fields originating from the brain. These fields result from synchronous activities of billions of neurons present in the brain. These fields are measured from scalp through sensors using different techniques developed over the time so that measurement can be precise,(More)
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