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—Silicon photonics is a new technology that should at least enable electronics and optics to be integrated on the same optoelectronic circuit chip, leading to the production of low-cost devices on silicon wafers by using standard processes from the microelectronics industry. In order to achieve real-low-cost devices, some challenges need to be taken up(More)
We report on a novel triple transit region (TTR) layer structure for 1.55 μm waveguide photodiodes (PDs) providing high output power in the millimeter wave (mmW) regime. Basically, the TTR-PD layer structure consists of three transit layers, in which electrons drift at saturation velocity or even at overshoot velocity. Sufficiently strong electric fields(More)
With metal stripes being intrinsic components of plasmonic waveguides, plasmonics provides a "naturally" energy-efficient platform for merging broadband optical links with intelligent electronic processing, instigating a great promise for low-power and small-footprint active functional circuitry. The first active Dielectric-Loaded Surface Plasmon Polariton(More)
We demonstrate Wavelength Division Multiplexed (WDM)-enabled transmission of 480Gb/s aggregate data traffic (12x40Gb/s) as well as high-quality 1x2 thermo-optic tuning in Dielectric-Loaded Surface Plasmon Polariton Waveguides (DLSPPWs). The WDM transmission characteristics have been verified through BER measurements by exploiting the heterointegration of a(More)
In this paper, we report on a novel photonic integrated 70 GHz band (71-76 GHz) photoreceiver module featuring a 1.55 μm double-waveguide photodiode (PD) implemented with a planar bias-T, a low-noise amplifier (LNA), a high-power amplifier (HPA) and a grounded coplanar waveguide (GCPW) to WR-12 rectangular waveguide transition. The photoreceiver(More)
PhoxTroT is a large-scale research effort focusing on high performance, low energy and low cost optical interconnects across the multiple hierarchy levels in High Performance Computing Systems and Data Centre environments. The project focuses on a holistic approach to the optical interconnect challenges, by synergizing different fabrication platforms and(More)
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