Tingbi Luo

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The formation and growth of intermetallic compounds of Sn-2.0Ag-2.5Zn solder on Cu and Ni substrates after soldering and subsequent aging process have been investigated in this study. Ni films were electrodeposited on copper substrates. The interfacial micrographs of solder joints prepared at 250°C for 15s and aged for 24h, 96h and 216 h(More)
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