Ting-Hua Hsieh

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Silicon foundries are enabling fab-less chip design companies to meet market demand of highly integrated devices as mobile applications are flourishing in recent years. Foundries are also enabling other sectors of the semiconductor industry to provide high performance systems to meet the required bandwidth for mobile applications. Significant investments in(More)
The fundamental differences between buried-channel (BC) and surface-channel (SC) devices adopting shallow trench isolation (STI) technology are studied by using silicon data and 2D process/device simulation. For wafers with intentionally enhanced STI divots, the well-known STI induced double-hump is extensively observed for SC NMOS devices. However, BC PMOS(More)
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