Ting-Chou Lin

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The integrated fan-out (InFO) wafer-level chip-scale package (WLCSP) s an emerging packaging technology, which typically consists of multiple redistribution layers (RDLs) for signal redistributions among multiple chips. There is still no published work specifically on the RDL routing for the InFO WLCSP. Published RDL routing works consider different types(More)
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