Ting-Chou Lin

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Many enterprises or institutes are building private clouds within their own data centers. Data centers may have different batches of physical machines due to annual upgrades, but the number of machines is fixed most of the time. Consequently it is crucial to schedule jobs with different resource requirements and characteristics to meet different job timing(More)
The integrated fan-out (InFO) wafer-level chip-scale package (WLCSP) s an emerging packaging technology, which typically consists of multiple redistribution layers (RDLs) for signal redistributions among multiple chips. There is still no published work specifically on the RDL routing for the InFO WLCSP. Published RDL routing works consider different types(More)
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