Timothy Huang

Sorry, we do not have enough data to show an influence graph for this author.
Learn More
Metallizing ultra-thin glass interposer with through-vias with high adhesion and at low cost is one of the primary challenges in producing next-generation glass-based system packages. This paper describes and investigates a new approach towards creating a glass interposer structure with through-vias that is ready for solution-based metallization such as(More)
Direct metallization of bare glass with copper is required to reach the full potential low-cost benefit of glass interposers. However, this poses a fundamental materials challenge associated with copper-to-glass adhesion. Intermediate polymer liners on glass have been used by others, adding an extra material and processing step. In this paper, three(More)
  • 1