Timothy B. Huang

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A via-first process for metallizing copper on glass substrates is presented using a thin, patternable polymer film, electroless copper deposition, and semiadditive processing. A procedure for(More)
This paper demonstrates the high frequency performance and thermo-mechanical reliability of through vias with 25 µm diameter at 50 µm pitch in 100 µm thin glass substrates. Scaling of(More)
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