Tilo Meister

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New technologies such as 3D integration are becoming a new force that is keeping Moore's law in effect in today's nano era. By adding a third dimension in current 2D circuits, we can greatly increase integration density, reduce interconnection length, and enable heterogeneous systems within one package. In order to exploit the advantages of 3D integration,(More)
The wiring effort and thus, the routability of electronic designs such as printed circuit boards, multi chip modules and single chip modules largely depends on the assignment of signals to component pins. For modern components that have as many as several thousand pins, this pin assignment cannot be optimized manually. This paper presents four novel pin(More)
In this paper the recent progress of active high frequency electronics on plastic is discussed. This technology is mechanically flexible, bendable, stretchable and does not need any rigid chips. Indium Gallium Zinc Oxide (IGZO) technology is applied. At 2 V supply and gate length of 0.5 μm, the thin-film transistors (TFTs) yield a measured transit frequency(More)