Tien Yu Wu

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  • Tien Yu Wu
  • Journal of the American College of Cardiology
  • 2016
TCT-793 Results of a Japanese IDE Trial Using Stent-Grafts for Treatment of SFA Disease confirm the importance of optimal sizing Takao Ohki, Kimihiko Kichikawa, Hiroyoshi Yokoi, Masaaki Uematsu, Terutoshi Yamaoka, Takeshi Baba, Reo Takizawa Jikei University School of Medicine, Tokyo, Japan; Emory University; Fukuoka Sanno Hospital, Sawara-ku, Japan; Hofstra(More)
The process-induced thermal stress field in a glob top encapsulated single chip module is studied in this paper. The coefficient of thermal expansion mismatch between the encapsulant (epoxy) and the chip (silicon) can generate a high stress field near the encapsulant/chip interface when the chip assembly cools to room temperature after processing. This(More)
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