Tianfu Jiang

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Wafer thinning for advanced packaging methods has gained importance as demand has increased for memory cards, portable computing systems, multiple chip packages (MCPs), and other applications that require thin integrated circuits (ICs). This paper gives an overview of the different industrial wafer thinning techniques - backgrind, poligrind, dry mechanical(More)
Although there is explosive growth of theoretical research on cognitive radio, the real-time platform for cognitive radio is progressing at a low pace. Researchers expect fast prototyping their designs with appropriate wireless platforms to precisely evaluate and validate their new designs. Platforms for cognitive radio should provide both high-performance(More)
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