Thomas N. Theis

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The members of the committee responsible for the report were chosen for their special competences and with regard for appropriate balance. Any opinions, findings, and conclusions or recommendations expressed in it are those of the authors and do not necessarily reflect the views of the National Science Foundation. Front cover: Three-dimensional scanning(More)
I s the decades-long era of exponentially compounding improvements in the cost and performance of computing devices about to end? Can we sustain progress in information technology hardware by developing some new switching device that can be made smaller, faster, and cheaper than the silicon tran-sistor? These were some of the questions raised by a panel(More)
Quantum physics provides an intriguing basis for achieving computational power to address certain categories of mathematical problems that are completely intractable with machine computation as we know it today. We present a brief overview of the current theoretical and experimental works in the emerging field of quantum computing. The implementation of a(More)
In this paper a novel computational strategy consisting of a special combination of numerical techniques is presented, which allows to perform flow simulations in the framework of co-rotating twin-screw extruders involving complex geometrical descriptions of rotating intermeshing internal boundaries. The individual techniques combined together are a a)(More)
Drop impact onto a solid surface is a complex phenomenon, which is depending on a variety of factors. To describe the fluid motion, the incompressible Navier-Stokes equations will be used. It is known that the inertial effects and the viscous and surface tension forces affect the evolution of the drop spreading and accordingly of the receding. The arising(More)
During the past few decades advances in semiconductor technology have had only modest implications for the design and verification of integrated systems. While "deep-submicron" effects created new challenges for guaranteeing electrical integrity and necessitated the bundling of traditionally separated design steps such as logic synthesis and physical(More)
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