Thomas N. Theis

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The members of the committee responsible for the report were chosen for their special competences and with regard for appropriate balance. Any opinions, findings, and conclusions or recommendations expressed in it are those of the authors and do not necessarily reflect the views of the National Science Foundation. Front cover: Three-dimensional scanning(More)
Quantum physics provides an intriguing basis for achieving computational power to address certain categories of mathematical problems that are completely intractable with machine computation as we know it today. We present a brief overview of the current theoretical and experimental works in the emerging field of quantum computing. The implementation of a(More)
Topic 1: What are the most promising research directions in the exploration of new devices for computing, and how should a research program be structured to accelerate progress?. At the device and circuit level, what are the key factors limiting progress in computing – particularly the energy efficiency of computing? .. Are their promising new device and(More)
I s the decades-long era of exponentially compounding improvements in the cost and performance of computing devices about to end? Can we sustain progress in information technology hardware by developing some new switching device that can be made smaller, faster, and cheaper than the silicon tran-sistor? These were some of the questions raised by a panel(More)
During the past few decades advances in semiconductor technology have had only modest implications for the design and verification of integrated systems. While "deep-submicron" effects created new challenges for guaranteeing electrical integrity and necessitated the bundling of traditionally separated design steps such as logic synthesis and physical(More)
The future of interconnection technology Continuing advances in interconnection technology are seen as essential to continued improvements in integrated circuit performance. The recent introduction of copper metallization, dual-damascene processing, and fully articulated hierarchical wiring structures, along with the imminent introduction of(More)
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