Thomas N. Theis

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The members of the committee responsible for the report were chosen for their special competences and with regard for appropriate balance. Any opinions, findings, and conclusions or recommendations expressed in it are those of the authors and do not necessarily reflect the views of the National Science Foundation. Front cover: Three-dimensional scanning(More)
Quantum physics provides an intriguing basis for achieving computational power to address certain categories of mathematical problems that are completely intractable with machine computation as we know it today. We present a brief overview of the current theoretical and experimental works in the emerging field of quantum computing. The implementation of a(More)
The piezoelectronic transistor (PET) has been proposed as a transduction device not subject to the voltage limits of field-effect transistors. The PET transduces voltage to stress, activating a facile insulator-metal transition, thereby achieving multigigahertz switching speeds, as predicted by modeling, at lower power than the comparable generation field(More)
The insights contained in Gordon Moore's now famous 1965 and 1975 papers have broadly guided the development of semiconductor electronics for over 50 years. However, the field-effect transistor is approaching some physical limits to further miniaturization, and the associated rising costs and reduced return on investment appear to be slowing the pace of(More)
I s the decades-long era of exponentially compounding improvements in the cost and performance of computing devices about to end? Can we sustain progress in information technology hardware by developing some new switching device that can be made smaller, faster, and cheaper than the silicon tran-sistor? These were some of the questions raised by a panel(More)
The future of interconnection technology Continuing advances in interconnection technology are seen as essential to continued improvements in integrated circuit performance. The recent introduction of copper metallization, dual-damascene processing, and fully articulated hierarchical wiring structures, along with the imminent introduction of(More)