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The effect of the surface roughness on nanoindentation results was investigated instancing a series of CrN thin films deposited by unbalanced magnetron sputtering. The arithmetic roughness (Ra) of the films ranged between 2 and 10 nm and was measured by atomic force microscopy. The measured surface topography was incorporated into a finite element model,(More)
The overall objective of this research work is the characterization of the mechanical behavior of Printed Circuit Boards (PCBs) under cyclic thermal loads. The conducting traces in PCBs are made from thin copper layers in an etching process. Hence, thin copper layers are characterized experimentally and subsequently cyclic material parameters are(More)
With the trend towards increasing complexity of Printed Circuit Boards (PCB), there has been considerable interest of investigation of the embedding process. The main focus has been set on the first step, the chip attachment by using an adhesive. Investigation of the adhesive thickness underneath the component by a numerical and an analytical model has been(More)
Many plant tissues and organs are capable of moving due to changes in the humidity of the environment, such as the opening of the seed capsule of the ice plant and the opening of the pine cone. These are fascinating examples for the materials engineer, as these tissues are non-living and move solely through the differential swelling of anisotropic tissues(More)
In continuum mechanics inelastic deformation is attributed to the aggregate effect of irreversible gliding of atoms along well defined planes whose number and orientation depends on the crystallographic structure of the material. Such a gliding plane and its pertaining gliding direction are termed " slip system ". It is activated by mechanical stresses(More)
The knowledge of thermally induced strains created during the assembly in Printed Circuit Boards (PCB) is an important issue for electronic packages. In the assembly process, a thin silicon-chip is attached onto a copper foil. The curing of the adhesive is followed by the cooling down of the assembled structure to room temperature. The different properties(More)
Novel design of microelectronic components creates new issues concerning their reliability. Internal mechanical loading, e.g. from residual stresses, or external loading when the component is assembled into a microelectronic device, can cause failure via cracking or delamination. In this work, finite element simulations of micro-beam bending experiments for(More)
Thin Au<sub>2</sub>Cu<sub>6</sub>Sn<sub>2</sub> solder joints have been identified to provide improved electrical and thermal device performance compared to thicker solder joints [1]. Both the material high thermal conductivity and the reduced joint thickness improve the thermal dissipation through the solder joint, making the thin(More)