Thomas Antretter

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The effect of the surface roughness on nanoindentation results was investigated instancing a series of CrN thin films deposited by unbalanced magnetron sputtering. The arithmetic roughness (Ra) of the films ranged between 2 and 10 nm and was measured by atomic force microscopy. The measured surface topography was incorporated into a finite element model,(More)
Nanoscale, multi-material thin film structures are commonly used in the design of microelectronic devices. Composites like these have the advantage of occupying a small volume in a specific device which makes a realization of 3D integrated circuits easier. Nonetheless, an arbitrarily fabricated thin film component will not automatically meet the(More)
Novel design of microelectronic components creates new issues concerning their reliability. Internal mechanical loading, e.g. from residual stresses, or external loading when the component is assembled into a microelectronic device, can cause failure via cracking or delamination. In this work, finite element simulations of micro-beam bending experiments for(More)
The overall objective of this research work is the characterization of the mechanical behavior of Printed Circuit Boards (PCBs) under cyclic thermal loads. The conducting traces in PCBs are made from thin copper layers in an etching process. Hence, thin copper layers are characterized experimentally and subsequently cyclic material parameters are(More)
The knowledge of thermally induced strains created during the assembly in Printed Circuit Boards (PCB) is an important issue for electronic packages. In the assembly process, a thin silicon-chip is attached onto a copper foil. The curing of the adhesive is followed by the cooling down of the assembled structure to room temperature. The different properties(More)
Thin Au<sub>2</sub>Cu<sub>6</sub>Sn<sub>2</sub> solder joints have been identified to provide improved electrical and thermal device performance compared to thicker solder joints [1]. Both the material high thermal conductivity and the reduced joint thickness improve the thermal dissipation through the solder joint, making the thin(More)
A microelectronic device, designed from multiple structured thin films of different materials deposited on each other, can have a very complex shape. Such a structure can show relatively high residual stresses, which lead to malfunctions and a decrease in lifetime of the device. In this paper a numerical method relying on an inverse optimization algorithm(More)
With the trend towards increasing complexity of Printed Circuit Boards (PCB), there has been considerable interest of investigation of the embedding process. The main focus has been set on the first step, the chip attachment by using an adhesive. Investigation of the adhesive thickness underneath the component by a numerical and an analytical model has been(More)