Tetsuhiro Sumimoto

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To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridges, missing connections, solder voids, open connections and miss-registrations of parts. As we can find mostly solder bridges in these defects, we pick up this to detect solder(More)
CONVENTIONAL SURFACE INSPECTION We have developed a new apparatus to cope W I T H LASER BEAM. with the surface inspection of products having even undulating or stepped surfaces. To realize such surface inspection, we combined the three dimensi~nal shape measurement through laser beam scanning and the flaw and defwct identification thmug h diffraction l ight(More)
A Stereoscopic microscope is widely used in a micre between the object and the needle is derived. The mimanipulation such as to operate genes and to inspect integration circuits. As in these tasks the micromanipulation is handled and makes too heavy burden to operators, it is desirable to perform cromanipulator is controlled to make this error signal to(More)
Radiochromic film (RC-film) is of great interest as a film-type dosimeter for radiation oncology applications. We present a two-dimensional image-based evaluation of the measurement accuracy of a commercial RC-film product (Gafchromic MD-55-2 film, ISP TECHNOLOGIES, Inc.) by using a commercial Laser Densitometer (Model 1710, Computerized Medical Systems,(More)
This paper describes the accurate shape inspection method of 3-D objects. To make measurement more precisely, we introduce a newly developed composite image sensor system. The image u n i t of the proposed system has two different type image sensors, area and line types. i t is so dcsigncd that i ts pixel composition is overlapped optically, so i t is(More)
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