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We demonstrate a novel vertical channel 3D NAND Flash architecture - SGVC. SGVC device is a single-gate, flat-channel TFT charge-trapping device with ultra-thin body. Our novel array decoding method(More)
We have successfully developed a 128Gb MLC (or 192Gb TLC) 3D NAND Flash using 16-layer SGVC architecture. The produced memory density is 1.6 Gb/mm2 for MLC or 2.4 Gb/mm2 for TLC (including CMOS(More)
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