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The financial backbone of the semiconductor industry is based on doubling the functional density of integrated circuits every two years at fixed wafer costs and die yields. The increasing demands for 'computational' rather than 'physical' lithography to achieve the aggressive density targets, along with the complex device-engineering solutions needed to(More)
Achieving the required time-to-market with economically acceptable yield levels and maintaining them in volume production has become a daunting task for the advanced technology nodes. These difficulties are primarily attributable to the increase in process variability that is incurred while aggressively scaling technology nodes which are based on the same(More)
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