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Journals and Conferences
We present a new test structure measuring inter- and intralayer coupling capacitance parasitic to the same target interconnection with subfemtofarad resolution. The coupling capacitance as well as… (More)
We propose non-destructive inverse modeling of copper interconnect cross-sectional structures, which reproduces the pitch dependence of intraand interlayer coupling capacitance parasitic to the… (More)
Computing-in-Memory has recently attracted increasing interest because of the expected limitations to be faced by the traditional von Neumann architecture under further extensions of Moore's law.… (More)
Extreme ultraviolet lithography (EUVL) is being introduced as next generation lithography of 32 nm node. Defect-free mask fabrication is one of the critical issues to lead EUVL. There are two types… (More)
In order to automate the quality and process design of steel plates, an expert system based on the case-based reasoning system has been developed. The case-based reasoning is a plausible approach for… (More)
A high-speed experimental method to evaluate the X-ray radiation damage of a large number of transistors has been developed. In this method, test-element groups (TEGs), including approximately 10,000… (More)
Since the numerical aperture of the optical system of the EUV microscope for mask inspection is as large as 0.3, the depth of focus becomes server within 100 nm. For this reason, the focus detection… (More)
K w h i r o Hamamoto Y m r u Tanaka Hirotake Kawashima l S 4 , Seung Yoon Lee l X 4 , Nobuyuki Hosokawa 2,4, Noriyuki Sakaya 374, Morio Hosoya 3,4, Tsutomu Shoki 3s4, Takeo Watanabe l X 4 and Hiroo… (More)
In this article explain the importance of outgassing and its characteristics in EUVL. Here discuss the decomposition reaction of the resist in EUV irradiation.
In this paper, we describes the cleaning of masks 172-nm excimer VUV radiation, which is more efficient for masks than the others.