Takashi Hiroi

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b fast and highly reliable method of inspecting minule solder joints of high-density rnouaed devices hns been dcveloperl. It uses two techniques to detect all types of defects, such as unsoldered leads. solder bridges. and mis-aligned leads. One applieszxternal Form to solder joints with an air jet. which vibrates w shifts unsoldered leads. The vibration(More)
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