Takahiro Kagami

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—In this paper, we demonstrate that we can reduce the communication latency significantly by inserting a fraction of randomness into a wireless 3D NoC (where CMOS wireless links are used for vertical inter-chip communication) when considering the physical constraints of the 3D design space. Towards this end, we consider two cases, namely 1) replacing(More)
—Power consumption of Network-on-Chip (NoC) is becoming more important in many core processors. Input buffers utilized in routers consume a significant part of the total power of NoCs. In order to reduce this power consumption, a novel power efficient memory called Marching Memory Through type (MMTH) is introduced. By connecting transparent latches in(More)
—A contact-less approach that connects chips in vertical dimension has a great potential to customize components in 3-D chip multiprocessors (CMPs), assuming card-style components inserted to a single cartridge communicate each other wirelessly using inductive-coupling technology. To simplify the vertical communication interfaces, static Time Division(More)
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