Takahashi Tokuda

Learn More
Abstract We have developed an on-chip image sensor with target applications of on-chip biomolecular and neural imaging. The sensor pixel can sense not only intensity of incident light, but also on-chip electric potential. The light shield structure on the pixel circuit was used as a sensing electrode. Once the passivation layer on the sensing electrode was(More)
Abstract—A CMOS image sensor which is capable to simultaneously sense an optical and an op-chip potential image was designed and fabricated. The sensor was designed with target applications to sense neural activities and DNA spots in on-chip configuration. We designed compatibly configured light sensing pixel and potential sensing pixel. The pixel size is(More)
In this presentation, we demonstrate a pulse-frequency-modulation (PFM)-based retinal stimulator for sub-retinal implantation using standard CMOS technology with low voltage operation of 1.2 V. A PFM-based photosensor converts input light intensity to electrical pulse trains whose frequency is proportional to the input light intensity. To employ simple(More)
For wide dynamic range, compatibility with digital circuits, and low-voltage operation, the pulse modulation technique is suitable for an implanted bioimage sensor. We demonstrate bio-fluorescence imaging of the hippocampus in a sliced mouse brain using a pulse modulation-based image sensor. The sensor architecture and system configuration are discussed. In(More)
We present a CMOS image sensor device for neural imaging and interfacing. The sensor device is postprocessed using MEMS microfabrication technique to enable backlit illumination. Pt electrodes are formed on the device for electrical stimulation of neurons. A specially developed packaging technique, which includes a color filter that increases the(More)
This paper describes the fabrication and in vitro/in vivo operation of a retinal stimulator based on CMOS multimicrochips. To enhance reliability and reproducibility for in vitro/in vivo with large array size, we introduce a flip-chip bonding technique and place microchips on the reverse side of a substrate. A microchip with a size of 600 μm square was(More)
  • 1