Tailong Shi

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This paper presents the design, fabrication, assembly, and characterization of a fully-integrated single-chip glass BGA package at 40/80 μm off-chip I/O pitch with multilayered wiring and through-package-vias (TPVs) at 160 μm pitch. The designed test vehicle emulates an application processor package for smart mobile applications, and enables(More)
Ultra-thin, panel-level glass fan-out packages (GFO) were demonstrated for next-generation fan-out packaging with high-density high-performance digital, analog, power, RF and mm-wave applications. The key advances with GFO include: 1) large area panel-scalable glass substrate processes with lower cost, 2) silicon-like RDL on large panels with 1-2 µm(More)
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