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- Publications
- Influence
Nanoimprint lithography for semiconductor devices and future patterning innovation
- T. Higashiki, T. Nakasugi, Ikuo Yoneda
- Computer Science, Engineering
- Advanced Lithography
- 17 March 2011
TLDR
Mix-and-match overlay method by compensating dynamic scan distortion error
- T. Kono, Manabu Takakuwa, Keita Asanuma, Nobuhiro Komine, T. Higashiki
- Engineering
- SPIE Advanced Lithography
- 29 April 2004
This paper discusses the compensation method and APC system to reduce errors in mix and matching overlay between scanners. We proposed the compensation model for intra-field errors in mix and… Expand
What is the strongest candidate in lithography for 2x nm HP and beyond?
- Kohji Hashimoto, Ikuo Yoneda, +5 authors T. Higashiki
- Materials Science, Engineering
- Lithography Asia
- 20 November 2008
We have investigated three candidate lithography technologies for 2x nm HP generation and beyond for the application to LSI, namely, double patterning technology (DPT), EUV lithography (EUVL) and… Expand
Nanoimprint lithography and future patterning for semiconductor devices
- T. Higashiki, T. Nakasugi, Ikuo Yoneda
- Materials Science
- 1 October 2011
Nanoimprint lithography (NIL) has the potential capability of high resolution with critical dimension uniformity that is suited for patterning shrinkage, as well as providing a low cost advantage.… Expand
Aberration budget in extreme ultraviolet lithography
- Yumi Nakajima, Takashi Sato, R. Inanami, T. Nakasugi, T. Higashiki
- Physics, Engineering
- SPIE Advanced Lithography
- 14 March 2008
It seems that the actual EUV lithography tools will have aberrations around ten times larger than those of the latest ArF lithography tools in wavelength normalized rms. We calculated the influence… Expand
Study of nanoimprint lithography for applications toward 22nm node CMOS devices
- Ikuo Yoneda, Shinji Mikami, +4 authors T. Higashiki
- Materials Science, Engineering
- SPIE Advanced Lithography
- 14 March 2008
Nanoimprint lithography is one of the candidates for NGL. Recently, the "S-FIL TM" (Step and Flash Imprint Lithography) has been developed by MII (Molecular Imprints, Inc.). Accordingly, it is… Expand
Development of a Platform for Collaborative Engineering Data Flow between Design and Manufacturing
- H. Morinaga, H. Kakinuma, T. Ito, T. Higashiki
- Engineering
- IEEE International Symposium on Semiconductor…
- 1 September 2006
The amount of collaborative engineering data between design and manufacturing is increasing because of the introduction of design for manufacturing (DFM) technology to improve product yield quickly.… Expand
Basic studies of overlay performance on immersion lithography tool
- K. Shiraishi, T. Fujiwara, +4 authors T. Higashiki
- Materials Science, Engineering
- SPIE Advanced Lithography
- 10 March 2006
Immersion lithography with ArF light and Ultra Pure Water (UPW) is the most promising technology for semiconductor manufacturing with 65 nm hp design and below. Since Nikon completed the first… Expand
Alignment mark signal simulation system for the optimum mark feature selection
- T. Sato, A. Endo, +5 authors Satoshi Tanaka
- Engineering
- SPIE Advanced Lithography
- 24 May 2004
Recently the overlay accuracy has got seriously severe. For the accurate overlay, signal intensity and waveform from the topographical alignment mark has been examined by signal simulation. Actually… Expand
Integration of a new alignment sensor for advanced technology nodes
- P. Hinnen, Jérôme Dépré, +6 authors T. Higashiki
- Computer Science, Engineering
- SPIE Advanced Lithography
- 16 March 2007
TLDR