T. Kahnert

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In the conversion towards Pb-free electronics, there has been increasing interest in conductive adhesive interconnects, as they combine Pb-free materials with an attractive, low temperature, processing. One such promising packaging concept is direct bonding of flip-chip dies onto printed wiring boards (PWBs), with adhesive bonds between a gold-bumped(More)
In the conversion to Pb-free electronics, there has been increasing interest in conductive adhesive interconnects, as they combine Pb-free materials with the added benefit of low temperature, processing [1]. This paper explores the the degradation mechanisms and kinetics in adhesively bonded Au-bumped flip chip interconnects. Earlier researchers have(More)
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