T. Bechtold

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SUMMARY A high power dissipation density in today's miniature electronic/mechanical systems makes on-chip thermal management very important. In order to achieve quick to evaluate, yet accurate electro-thermal models, needed for the thermal management of microsystems, a model order reduction is necessary. In this paper, we present an automatic,(More)
An overview of electro-thermal modeling of microsystems is presented. We consider the most important coupling between thermal and electrical phenomena, and then focus on the indus-try's central concern, that of Joule heating. A description of different solution approaches for the heat transfer partial differential equation, which constitutes the central(More)
In this paper, we present three heuristic error indicators for the iterative model order reduction of electro-thermal MEMS models via the Arnoldi algorithm. Such error indicators help a designer to choose an optimal order of the reduced model, required to achieve a desired accuracy, and hence allow a completely automatic extraction of heat-transfer(More)
Different methodologies to extract a dynamic compact thermal model of a microelectronic or MEMS device have been developed in recent years. They include strategies based on data fitting, a time-constant spectrum, modal analysis and finally formal model reduction. Researchers seek compact thermal multiport representation for system level simulation. However,(More)
Model reduction is a very helpful tool to generate compact models for system-level simulation. Quite often however, system matrices depend on design parameters and the new goal is not only to reduce the original system but also to preserve system parameters in the symbolic form during model reduction. We introduce multivariate moment matching as a possible(More)
A modelling strategy for a microthruster array based on solid fuel is presented. We review the theory of operation of the microthruster that includes an electro-thermal process, ignition, sustained combustion, membrane rupture and gas dynamics. The recommended level of theory is chosen to answer practical engineering questions, so as to make the recommended(More)
In this paper we present a novel approach to determine material thermal properties of thin film materials. As a testcase we have chosen silicon nitride employed in a micro-hotplate structure. We use ANSYS to build a three-dimensional finite element (FE) model of the test structure, which considers heat conduction and convection effects. It is further(More)
In this paper we present a new possibility to determine unknown material thermal properties based on experimental measurements. We use a parametrized finite element (FE) model and fit it to a measured transient curve. Using brute force, this process requires an extensive computational time. However, it is possible to speed it up significantly by using model(More)