Syed Sajid Ahmad

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Often the greatest cost for developing a new package or system is the acquisition of bare chips. To meet this challenge, a unique technique involving laser and plasma has been developed for extracting dice or chips for reuse and repackaging. Epoxy molded integrated circuit (IC) packages are decapsulated using a combination of a neodymium-doped yttrium(More)
Human brains are perhaps the most intricate and powerful computing devices on our planet and communication through languages the most complex behavior known to mankind. For centuries, people have speculated over the origins of human language. What is the world’s oldest spoken language? Have all languages developed from a single source? How did words come to(More)
The quality and reliability of electronic systems depend on the integrity of interfacial adhesion. Adhesion is critical at all electronics assembly levels. Material layers on a chip, package and system need to have excellent adhesion to each other. Thin films are an integral part of chip devices and also are necessary at other levels of electronic systems.(More)
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