Swapnil Athavale

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As computers become more pervasive in society, facilitating natural human–computer interaction (HCI) will have a positive impact on their use. Hence, there has been growing interest in the development of new approaches and technologies for bridging the human–computer barrier. The ultimate aim is to bring HCI to a regime where interactions with computers(More)
With the increasing popularity of portable electronic devices and industry moving to lead-free soldering, the brittle fracture of solder joints has become a major concern for component as well as system manufacturers. Normally testing of a solder joint's resistance to brittle fracture is done via drop shock. In addition to being an expensive and time(More)
Electrolytic CuNiAu over pad metallization (OPM) was qualified for high temperature gold wire bonding applications. Stability of the CuNiAu OPM metal stack was tested through extreme conditions, i.e.: ambient temperature 250 °C up to 4000 hours, with satisfactory results. Reliability of CuNiAu OPM was then confirmed in series of tests with ambient(More)
Even though lead is supposed to disappear from most of the electronic components in the near future, there is still an industry wide intense effort to find new lead-free alloys, or variations within the existing general class of widely accepted lead-free SnAgCu alloys. For each of these alloys it is important to find optimum, applications based/specific and(More)
Electrolessly plated over pad metallization (OPM) was evaluated for high temperature gold wire bonding applications. Bonding strength, measured by wire bond bump shear test, of 4N gold wire on electroless OPMs, such as electroless nickel/immersion gold (ENIG), electroless nickel/electroless palladium (ENEP), and electroless nickel/electroless(More)
Poly(acrylonitrile-co-vinyl chloride) (PAN/VC) anisotropic membranes were chemically modified with poly(ethylene oxide) (PEO) (5000 and 20,000 g/mol) by one of two aqueous reactions: (a) acid hydrolysis of the nitrile group to a carboxylic acid with which amine-terminated PEO (PEO-NH(2)) reacted or (b) base reduction of the nitrile group to an amine with(More)
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