Suryanarayana Shivakumar Bhattacharya

We don’t have enough information about this author to calculate their statistics. If you think this is an error let us know.
Learn More
In this paper, the impact of signal and power/ground pin assignment in multi-layer printed circuit board (PCB) on signal integrity (SI) performance is studied. Efficient return signal current path plays an important role to preserve SI and minimize unwanted crosstalk. Moreover, a high pin count ratio of signal to power/ground is desirable to increase(More)
Two vertical transitions with through silicon vias (TSVs) in 3D die stack are designed and their high frequency electrical characteristics are presented in this paper. The two vertical transitions consist of TSVs for obtaining electrical connection between the die front side and back side. Back side redistribution layer is eliminated in the designs to(More)
  • 1