Suresh Santhanam

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Spiral inductors fabricated in a 0.18µm 6-level Cu interconnect low-K dielectric process suspended 100µm above the substrate with sidewall oxide removed are described. A maskless post-CMOS micromachining process has been developed for the low-K dielectric copper interconnect process. Post-CMOS process enhancements of inductors provide higher quality factors(More)
—On-chip spiral micromachined inductors fabricated in a 0.18-m digital CMOS process with 6-level copper interconnect and low-K dielectric are described. A post-CMOS maskless mi-cromachining process compatible with the CMOS materials and design rules has been developed to create inductors suspended above the substrate with the inter-turn dielectric removed.(More)
Regioregular polythiophene-based conductive copolymers with highly crystalline nanostructures are shown to hold considerable promise as the active layer in volatile organic compound (VOC) chemresistor sensors. While the regioregular polythiophene polymer chain provides a charge conduction path, its chemical sensing selectivity and sensitivity can be altered(More)
Multiple regioregular polythiophene polymers with a variety of side chains, end groups and secondary polymer chains were used as active sensing layers in a single chip chemresistor sensor array device. A custom inkjet system was used to selectively deposit the polymers onto the array of transduction electrodes. The sensor demonstrated sensitivity and(More)
The use of gold nanoparticles coated with an organic monolayer of thiol for application in chemiresistive sensors was initiated in the late 1990s; since then, such types of sensors have been widely pursued due to their high sensitivities and reversible responses to volatile organic compounds (VOCs). However, a major issue for chemical sensors based on(More)
—New synthesis methods have allowed us to make many semiconducting polythiophenes polymers with different side and end groups. Also, co-polymers combining a polythiophene chain attached to another polymer chain were synthesized. This design freedom brings a new dimensionality to the sensing properties of the materials. Single chip micro sensor resistor(More)
This paper explores the decrease in interconnect capacitance that can be achieved by the use of mesa-shaped wires. A methodology for creating mesa interconnect is described that uses simple postprocessing steps following standard CMOS IC foundry processes. By removing the oxide between metal lines and replacing it with air, the fringing capacitance between(More)
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